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MOQ : 100
Model NO. : HC-FPC-002
Combination Mode : Adhesive Flexible Plate
Conductive Adhesive : Conductive Silver Paste
Flame Retardant : HB
Processing Technology : Electrolytic Foil
Base Material : Aluminum
Insulation Materials : Organic Resin
Average Thickness : 1.1-0. Am
Copper Foil Type : Electrolytic and Rolled
Copper Foil Thickness : 1oz, 1/2oz, 1/3oz
Substrate Film Thickness : 1mil, 1/2mil
Cover Film Thickness : 1mil, 1/2mil
Stiffener Thickness : 3mil to 9mil
Production Capacity : 100,000PCS/Month
HS Code : 8536500000
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Double-Sided Flexible Printing Membrane Printed FPC Circuit Images |